Clean Room
HS HI-TECH relocated its office to the Dongtan industrial complex in 2016 and secured 3,300m² - large clean room.
(management standard ≤ 50,000EA ↓ @ 0.5㎛, actual measurement data: 1,000 or under)


Assembly inspection equipment
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Eccentric measuring instrumentMeasures wafer wobble among Vision-based rotation.
Measures up to slight wobble as minute as the unit of 0.001mm.
Removes defect element occurring while Wafer rotation. -
Balance measuring instrumentMeasures vibration imbalance occurring while motor rotation.
Minimizes vibration by balancing rotor weight.
Removes defect Wafer element by vibration. -
3D measuring instrumentAutomated 3D precision measuring of appearance dimension.
Measures height and distance according to equipment joint reference position.
3D measuring device for the inspection of product optimization status.
Measuring equipment
Drag the table to the side.










