ENGLISH
Spin-chuck (Wet Clean)
We have developed and produced Spin Chuck for wafer fixation of Wet Clean equipment for the purpose of wafer etching, cleaning, rinse, and drying. It is utilized for surface and back processing as well as diverse processing of 300mm and 200mm. Depending upon clients’ main liquid chemical and equipment of use, we can develop customized material and new chuck using various materials.
Contact usProduction upon customer demand
HS R&D Center
know-how on semiconductor cleaning equipment
accumulated for over 10 years
In-house processing from designing, test, processing,
assembly, to quality control and delivery
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OEM
The Company engages in OEM production of key cleaning equipment parts from top global semiconductor equipment firm.
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ODM
Based on its OEM production know-how and technological power gained in the semiconductor cleaning equipment sector, the Company performs ODM production and delivers.
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Reverse Engineering
Based on our own component analysis and reverse engineering capacity, we can repair and maintain spin chuck.
Production Reference
| Operational Method | Gear-Ball Screw Deriving |
|---|---|
| Service Temp | 45℃ ~ 220℃ |
| Base Material | Engineering Plastic (PEEK, PVC, etc.) |
| Chemical | HF, SC1, SPM, LPSPM, DSP, DHF, LAL, POLY, T-dryer, ESC(organic chemistry), O3HF, O3DIW |